Package Design | packagedesignmag.com

By Linda Casey

A new high temperature material simulates the thermal performance of engineering plastics for dimensional stability in 3D prototypes. The material’s temperature resistance (a heat deflection temperature at 0.45MPa of 149 deg F out of the printer and 176 deg F after a short oven-based, post-thermal treatment) enables testing of package prototypes with hot air and liquids.

The material (RGD525) can be used on Objet Connex500 and Eden500V 3D printers. The manufacturer plans to make the material available on additional platforms during 2012.

In addition to its high thermal functionality, the material features smooth surfaces that enable post-processing applications such as gluing, painting and metal coating.

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