A new high temperature material simulates the thermal performance of engineering plastics for dimensional stability in 3D prototypes. The material’s temperature resistance (a heat deflection temperature at 0.45MPa of 149 deg F out of the printer and 176 deg F after a short oven-based, post-thermal treatment) enables testing of package prototypes with hot air and liquids.
The material (RGD525) can be used on Objet Connex500 and Eden500V 3D printers. The manufacturer plans to make the material available on additional platforms during 2012.
In addition to its high thermal functionality, the material features smooth surfaces that enable post-processing applications such as gluing, painting and metal coating.
Packaging’s influence grows at Graph Expo
Graph Expo, the largest graphic communications exhibition in the Americas, returned to Chicago’s McCormick Place in September. The show hosted more than 475 exhibitors overall and, for the third year in a row, featured the PackPrint Pavilion.
Products and services that can quickly transform designs into sample and prototype packages.