Find the Latest Innovations at Pack Expo International 2008

By Lynn Dornblaser

Global brand owners and package designers can discover the latest packaging technologies to enhance brand preference, improve sustainability scores, and reduce total systems costs by attending Pack Expo International, November 9-13, 2008 at McCormick Place in Chicago, IL.

Sponsored and produced by PMMI, Pack Expo International will highlight innovation across the entire packaging spectrum, including equipment, materials, containers and components. This "one-stop shopping" approach allows attendees to examine how different technologies can work in concert with each other and help speed new product introductions.

"With its size and scope comes breadth and depth. Pack Expo International is a unique opportunity for buying teams to achieve national and global packaging objectives for 2008 and beyond, " says Charles D. Yuska, president and CEO of PMMI. "Companies can cost-effectively discover a wide range of machinery and materials to refresh existing brands, introduce new products, streamline operations and reduce carbon footprint—all in a single location."

Technology in-depth and up close

Complementing the Pack Expo International exhibits will be several important technology pavilions. The Containers & Materials Pavilion, one of the show's most highly visited destinations, will feature advanced materials and containers to enhance brand differentiation, increase sales at the retail shelf and bring greater convenience for stronger brand equity.

The Showcase of Packaging Innovations™, sponsored by The Dow Chemical Company, will highlight hundreds of award-winning packaging designs from internationally recognized packaging associations. In addition, packages nominated for the Pack Expo Selects™ program, recognizing best-in-class consumer packaging, will also reside here.

The Radio Frequency Identification (RFID) Pavilion will return to Pack Expo, highlighting solutions that meet the requirements of the entire supply chain. Included in the exhibits will be technologies to upgrade conventional lines into RFID-enabled packaging lines capable of applying multi-pack, case, and pallet tags online. The Brand Protection Center will focus on the latest security technologies, brand protection devices, tamper evident features and new materials. Government organizations and other informational resources will also be on hand to help guide attendees in the best ways to maintain brand integrity.

Designed to recognize the importance of contract packaging services in today's vibrant marketplace, the Contract Packaging Pavilion offers a great starting point for assessing a project and exploring the many possible options provided by contract packaging partners. Exhibits will focus on the latest services, packaging formats and machinery available.

The return of Process Expo and Converting and Package Printing Expo (CPP Expo) as co-located events adds extra convenience and value to the Pack Expo International experience. CPP Expo will focus on the market synergies of the package printing, converting, finishing machinery and supplies industries. Attendees will find the latest technologies for package printing, coating, slitting, and other state-of-the-art finishing processes to streamline operations and improve quality. CPP Expo exhibits will be located on the Lobby Level of Lakeside Center at McCormick Place.

Packaging professionals interested in attending Pack Expo International can register online at www.packexpo.com now and save 50% off registration fees. This $30 single admission fee covers entrance to all Pack Expo International exhibits and pavilions as well as both colocated events. After October 21, 2008, the full admission rate is $60.

Early registrants have the additional benefit of pre-planning their tip to Chicago with the help of My Pack Expo ™. Developed to help attendees make the most of their time during the show, My Pack Expo focuses planning efforts by allowing attendees to locate specific suppliers and solutions, make booth appointments, register for applicable Conference at Pack Expo sessions, and talk with other show attendees —all in advance of arriving in Chicago. For more information about Pack Expo International 2008, visit www.packexpo.com or contact PMMI's Show Department: (703) 243-8555 or expo@pmmi.org.